職務說明 / Key Responsibilities
• Develop next generation EP (electroplating) products, process & related technologies for printed circuit board (PCB) and other metallization applications.
• Explore new ingredients through patent landscape analysis, fundamental understanding, experiment design, data analysis, and result interpretation.
• Establish new methodologies to tackle customers’ critical issues via understanding of customer needs.
• Assists in research efforts to improve existing products or create new applications.
• Support manufacturing technology development to speed up product commercialization.
• Provide training to research assistants and sales representative.
需求條件 / Key Requirements
• PhD/MS degree in Chemistry/Chemical Engineering/Material Science and Engineering is required.
• Experience in formulation development, DOE experience and industrial working experience (1~5 years) is a plus.
• Ability to work and communicate effectively within the organization.
• Independent researcher, as well as team work is required.
• Fluent in English & Mandarin.
• Good computer proficiency.
-薪資獎金制度及保險事宜
優於市場的薪資架構,年薪十二個月+2個月年終獎金
激勵獎金計劃:按公司營運績效及組織目標成效給與
服務每滿五年之員工可獲得服務年資獎勵
除政府規定之6%提撥,公司額外替每位員工提撥退休金至公司個人專戶
健保、勞工保險
免費團體保險(含壽險、意外、住院、癌症醫療團體保險)。員工配偶及子女享有免費 團保住院醫療險、意外傷害醫療險、癌症醫療險。
-休假制度
新進員工到職當月即享有特休假(依到職日按比例計算), 每年額外有彈性休假
病假:加入公司第二年度起享有30天全薪病假
事假:提供優於勞基法之有薪事假
產假、陪產假: 女性員工於分娩前後,給予產假12週;員工於其配偶分娩時,享10日陪產假
育兒假:員工在職服務期間生產,新生兒一歲前女性員工享有4週,男性10日之全薪育兒假
-員工福利
國際商務旅行提供國際SOS全球資源確保海外健康醫療安全
EAP員工關懷專案
定期提供員工健康檢查與免費疫苗施打
公司具有專業護理師人員並定期提供職業病專科醫師駐廠問診
福委會年度旅遊補助
設有各式公司社團及康樂活動